Designed to instantly remove leftover paper from chemically-etched dies wafer-thin dies and cut out designs. The sleek ergonomic rubber-grip handle allows for non-slip and easy maneuverability as it smoothly rolls away excess paper. This package contains 5-1/2x1-3/4x1-1/4 inch die brush tool and one 7x4- 1/2x1/2 inch foam pad. Imported.